Large Language Models (LLMs) demand immense amounts of memory, and the more people use them, the more memory is required.

Jensen Huang hinted that Nvidia will be the largest customer of HBM4 solutions as the company launches next-generation chips.

Solving a tricky 3D integration problem could boost bandwidth and keep chips cooler ...

Researchers in Korea and Japan have proposed sideways-stacked DRAM designs that could push future AI memory beyond ...

Use left and right arrow keys to seek audio. SK hynix has teased that it will be showcasing its innovative AI memory technologies at CES 2025, with a bunch of C-level executives including the CEO will ...

SK hynix announced on June 19 that it showcased a wide range of memory products for artificial intelligence (AI) infrastructure, including High Bandwi ...

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

SAN JOSE, Calif.--(BUSINESS WIRE)--KIOXIA America, Inc. today announced that its KIOXIA LC9 Series 245.76 terabyte (TB) 1 enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC ...

Use left and right arrow keys to seek audio. Rambus has provided more details on its upcoming HBM4 memory controller, which offers some huge upgrades over current HBM3 and HBM3 memory controllers.

A Korean research team has developed a technology that enables the stable stacking of more than 10 ultrathin semiconductor ...