Cadence Expands AI Agents With AuraStack For PCB And Advanced Chip Packaging

Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just ...
PlasticsToday

Cadence Launches AI Super Agent for PCB, Packaging Design

Cadence launches AuraStack AI Super Agent on Allegro AI Studio platform to automate PCB and advanced packaging design ...

Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging

Cadence (Nasdaq: CDNS) today introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, the world’s first agentic AI platform for printed circuit board (PCB) and advanced packaging ...
Purdue University

Purdue’s new institute for advanced system integration and packaging honors Boilermaker and innovative visionary in semiconductors

Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...
POWER Magazine

Advanced Power Grid Sensors and Switches Reduce Downtime and Improve System Reliability

A Fault Isolation Service Restoration module, part of an Advanced Distribution Management Solution, has improved grid reliability, and reduced outages and outage durations, for customers of PPL ...
Michigan Technological University

Online Advanced Electric Power Engineering Certificate

Earn an Online Advanced Electric Power Engineering Certificate and Help to Fill a Talent Shortage. Electric power engineering, a subfield of electrical engineering, is dedicated to electric power: ...